Photolithography is the heart of semiconductor manufacturing.
It’s the most capital-intensive and sensitive area of the fab, where precision, timing, and coordination are critical.
With up to 50 exposure layers per product, reticles must arrive at the exposure equipment exactly when needed.
Downtime or delays are unacceptable — the lithography area sets the pace for the entire production process.
Yet, daily operations in the fab are full of challenges:
- Limited buffer capacity at loadports and reticle libraries
- Ergonomically difficult access to reticle ports
- Manual processes that introduce risk and inefficiency
Reticle handling in semiconductor fabs is still often manual, leading to:
- Risk of contamination and reticle damage
- Inefficient storage and retrieval processes
- High personnel costs and ergonomic challenges
- Limited traceability and integration with MES systems
With up to 50,000 reticles per fab stored across decentralized locations,
fast and reliable automated access is critical to maintaining
lithography performance and overall fab efficiency.
On-time Reticle Availability at the Tools
Contamination-free Transport and Storage
Centralized Control and Scheduling
Reduced Personnel Costs and Safety Risks
Full Traceability of Reticle Movements
Seamless Integration into your MES
