| CHEMICAL EQUIPMENT
Semiconductor Wet Bench Solutions Built Around Your Process
From research and pilot lines to specialty manufacturing, Fabmatics USA delivers configurable wet bench solutions, wet process equipment and chemical delivery systems for compound semiconductors, SiC, GaN, photonics, MEMS, advanced packaging and adjacent high-tech applications.
Our systems support wafer cleaning, wet etching, surface preparation and specialty chemical processes through manual, semi-automated and fully automated configurations engineered around your process requirements.
| Why Fabmatics
Configurable Solutions for Specialized Applications
Semiconductor manufacturers need wet processing equipment that adapts to evolving process requirements while supporting long-term production goals. Fabmatics USA combines configurable wet bench platforms with application-focused engineering support to help customers achieve reliable processes, operational efficiency and scalable manufacturing performance.
APPLICATION-SPECIFIC CONFIGURATION
Tailor process tanks, materials, and layouts to your chemistry, substrates, and facility requirements.
FLEXIBLE AUTOMATION
Match manual, semi-automated, or fully automated operation to your process needs and production goals.
INTEGRATED PROCESS CONTROL
Support consistent, repeatable processing through recipe control, chemical monitoring, and dosing options.
U.S. SALES & SUPPORT
Connect with a local team to discuss applications, evaluate configurations, and coordinate technical support.
| PROCESS EQUIPMENT
Wet Bench Solutions
From process development and pilot production to high-volume manufacturing, Fabmatics USA delivers wet processing platforms engineered around your application, chemistry and production requirements. Choose from manual, semi-automated, fully automated wet bench solutions and chemical delivery systems designed to support process consistency, operator safety, and manufacturing scalability.
FUME HOOD SYSTEMS
Safe, Flexible Chemical Handling
Engineered airflow captures and removes hazardous vapors, while chemical-resistant construction and spill containment support demanding wet-process work.
Ideal for
R&D • Chemical Preparation • Low-Volume Processing
- Exhausted enclosure for controlling acid, solvent, and chemical vapors
- Chemically resistant construction such as polypropylene, PVC, stainless steel, or fire-rated materials
- Manual work surface with spill containment
- Chemical-compatible sink, drain, and rinse facilities
- Adjustable exhaust and airflow monitoring
- Utility connections for DI water, nitrogen, vacuum, compressed air, and process gases
- Safety interlocks, emergency shutoff, and leak detection
- Compatible lighting and electrical components for the chemical environment
- Heated chemical baths or hot plates
- Recirculating or filtered process tanks
- Solvent-rated or acid-rated fire suppression
- Scrubbed exhaust connection
- Integrated chemical storage cabinets
- Point-of-use chemical dispensing
- Neutralization or waste-segregation systems
- Wafer spin rinser/dryer or nitrogen drying station
- HEPA or ULPA-filtered downflow for improved particle control
- Flexible platform for chemical preparation, cleaning, and experimental work
- Strong operator protection when correctly designed and balanced
- Can accommodate many container sizes, substrates, and process types
- Lower cost and shorter installation time than dedicated automated equipment
- Easy access for process development and maintenance
- R&D and university laboratories
- Chemical mixing and sample preparation
- Low-volume wafer or component processing
- Failure analysis and materials laboratories
- Nonstandard substrates, parts, fixtures, and laboratory glassware
- Processes requiring maximum flexibility rather than tight automation
MANUAL PROCESS SYSTEM
Flexible, Operator-Controlled Processing
Dedicated chemical baths, temperature control and DI-water rinsing deliver repeatable batch processing with direct operator oversight.
Ideal for
R&D • Pilot Lines • Specialty Manufacturing
- Dedicated process tanks arranged in a defined sequence
- Operator-controlled wafer transfers using carriers or handling tools
- Acid, alkaline, solvent, or mixed-chemistry configurations
- Temperature-controlled chemical baths
- Quick-dump rinse, overflow rinse, or cascade-rinse modules
- DI-water rinsing and nitrogen or spin drying
- Exhaust, spill containment, leak detection, and emergency shutdown
- Basic timers, temperature controllers, and process-status indicators
- Megasonic or ultrasonic cleaning
- Recirculation, filtration, and bath agitation
- Automatic chemical replenishment
- Resistivity, temperature, concentration, or bath-life monitoring
- Lift-off lids and powered sash systems
- Heated dump rinsers
- Integrated rinser/dryer
- Recipe guidance, barcode tracking, and data logging
- Wafer-carrier elevators or ergonomic transfer aids
- Greater process consistency than a general-purpose fume hood
- Flexible enough for frequent recipe changes
- Lower capital and maintenance costs than full automation
- Operators can visually inspect wafers and intervene when necessary
- Suitable for multiple processes on one configurable platform
- Practical transition from laboratory development to low-volume manufacturing
- Process development and pilot lines
- Low- to medium-volume production
- MEMS, compound semiconductor, photonics, and research applications
- Facilities processing several wafer sizes or product types
- Operations with frequent recipe changes
- Processes where manual inspection and judgment remain valuable
MODULAR AUTOMATED SYSTEM
Repeatable, High-Throughput Processing
Robotic wafer handling, recipe-controlled processing and integrated monitoring improve consistency, traceability and operator safety.
Ideal for
Volume Production • Qualified Recipes • Yield-Critical Processes
- Robotic wafer-carrier handling between process modules
- Recipe-controlled chemical processing, rinsing, and drying
- Programmable immersion time, temperature, agitation, and transfer speed
- Automated bath filling, draining, replenishment, and life tracking
- Chemical delivery and waste-management integration
- Comprehensive safety interlocks and fault recovery
- Process data logging, alarms, user-access control, and audit trails
- Factory automation interfaces such as SECS/GEM
- Enclosed, controlled processing environment
- Megasonic cleaning
- Advanced chemical concentration monitoring and dosing
- Ozone-infused or dissolved-gas DI-water processes
- IPA vapor, Marangoni, spin-rinse, or hot-N₂ drying
- Front-opening unified pod/load-port integration
- Wafer identification and carrier tracking
- Equipment scheduling and manufacturing execution system integration
- Automated particle monitoring and statistical process control
- Redundant critical components for higher equipment availability
- Automatic sampling and endpoint or bath-health monitoring
- High repeatability and wafer-to-wafer consistency
- Reduced operator exposure to hazardous chemicals
- Lower risk of handling errors and cross-contamination
- Higher throughput with predictable cycle times
- Complete process traceability
- Better control of chemical consumption and bath utilization
- Suitable for tightly controlled production environments
- Reduced dependence on individual operator technique
- Medium- and high-volume semiconductor manufacturing
- Production processes with stable, qualified recipes
- RCA cleaning, pre-diffusion cleaning, oxide stripping, and metal cleaning
- Applications requiring traceability and statistical process control
- High-value products where consistency and yield justify the investment
- Facilities seeking reduced chemical exposure and labor content
SINGLE-WAFER SYSTEM
Wafer-Level Control, Lower Chemical Use
Spin-based dispense, rinse and dry processing provides uniform results, rapid recipe changes and reduced cross-contamination.
Ideal for
Post-CMP Cleaning • Surface Preparation • Edge & Backside Cleaning
- Processes one wafer at a time in an enclosed chamber
- Spin-based chemical dispense, rinse, and dry operation
- Precise control of dispense rate, position, temperature, and process time
- Minimal chemical volume compared with immersion baths
- Programmable recipes
- Edge, backside, or full-wafer processing capability
- High-purity chemical and DI-water delivery
- Controlled exhaust and enclosed splash containment
- Noncontact or low-contact wafer handling
- Megasonic nozzle cleaning (in progress)
- Two-fluid atomizing nozzles
- Heated chemicals dispense
- Ozone water, dilute HF, SC-1, SC-2, SPM, or solvent capability
- Edge-bead removal and backside cleaning
- Multiple chambers for parallel processing
- Pre-aligner, wafer mapping, and robotic load ports
- N₂, IPA, or advanced low-watermark drying
- Chamber self-clean and automated chemical switching
- Excellent wafer-level uniformity and process control
- Greatly reduced chemical use and waste generation
- No shared bath, reducing wafer-to-wafer cross-contamination
- Rapid recipe changes without replacing a large chemical volume
- Strong traceability because every wafer has an individual process record
- Well suited to short process steps and sensitive surfaces
- Easier isolation of contamination events
- Can selectively process wafer frontside, backside, or edge
- Advanced-node and high-value wafer processing
- Pre or Post-CMP cleaning
- Pre-deposition and pre-bond surface preparation
- Backside and wafer-edge cleaning
- Image-sensor, MEMS, power-device, and compound-semiconductor processes
- Processes using expensive chemicals or requiring low chemical consumption
- Applications sensitive to cross-contamination, watermarks, or batch variation
- Mixed-product manufacturing requiring frequent recipe changes
| PROCESS EQUIPMENT
Chemical Delivery Systems
High-purity systems solutions that protect yield, improve operator safety and keep production running. Precise chemical control, automation and traceability reduce contamination, process variation, downtime, chemical waste and operating costs
BULK CHEMICAL TRANSFER
High-Purity Delivery System
Automated transfer from drums, totes or bulk tanks with double containment, leak detection and closed-loop monitoring protects chemical purity, personnel and production uptime.
Ideal for
Acids • Bases • Solvents • High-Volume Fab Distribution
BULK CHEMICAL DISPENSE
Accurate, Repeatable Dispensing
Automated delivery with controlled flow, pressure regulation and point-of-use filtration ensures consistent dosing, chemical purity and operator safety.
Ideal for
Acids • Bases • Solvents • Process Tool Supply
BULK CHEMICAL BLENDING
Consistent Recipe-Controlled Blends
Automated proportioning, mixing, filtration and concentration verification produce uniform high-purity chemistry with complete batch traceability.
Ideal for
Diluted Acids • Bases • Solvent Blends • Custom Formulations
| INDUSTRIES & APPLICATIONS
Industries We Serve
Compound Semiconductors
Supporting SiC, GaN and advanced material applications where yield improvement and process consistency are critical to profitability.
Photonics
Wet processing solutions designed for applications where contamination control and process precision directly impact device performance.
MEMS & Sensors
Flexible platforms supporting repeatable manufacturing processes while helping reduce production costs and improve operational efficiency.
Advanced Packaging
Scalable solutions designed to improve throughput, process flow and production capacity within a compact equipment footprint.
Applications & Processes
Supporting critical wet-processing applications across semiconductor manufacturing environments, from wafer cleaning and precision etching to photoresist processing, metal lift-off and electroplating. Typical applications include RCA cleaning (SC-1/SC-2), HF-based oxide removal, silicon nitride etching, photoresist stripping and advanced packaging processes where contamination control, repeatability and process stability are essential.
| ENGINEERING & U.S. SUPPORT
Semiconductor Expertise Backed by Local Support
Fabmatics USA combines the capabilities of a wet bench manufacturer, engineering partner and semiconductor automation specialist. Customers benefit from configurable solutions, application-focused engineering and local U.S. support backed by global engineering resources and manufacturing capabilities.
What Customers Value
- Configurable solutions tailored to specific applications
- Semiconductor process and automation expertise
- Local U.S. sales and support
- Global engineering resources
- Scalable solutions from R&D through production
- Long-term technology partnership
Trusted by Leading Fabs Worldwide
As a trusted engineering partner for semiconductor manufacturers, Fabmatics USA delivers wet bench systems and chemical delivery sysems that support both specialty applications and production-scale manufacturing.
35+ Years Experience
Brownfield Specialist
One-Stop-Partner
Engineering Partnership
Frequently Asked Questions About Wet Bench Solutions
Fabmatics U.S. wet bench systems support a wide range of semiconductor, MEMS, compound semiconductor, advanced packaging, and specialty substrate wet processing applications. Typical processes include wafer cleaning, chemical etching, resist stripping, oxide removal, metal lift-off, surface preparation, rinse and dry operations, and specialty chemical treatments. Systems can be configured for both batch and single-carrier processing depending on throughput and process requirements.
Fabmatics U.S. wet bench platforms can be designed to accommodate various wafer and substrate sizes, ranging from small research wafers to high-volume production formats. Common configurations support 100 mm, 150 mm, 200 mm, and 300 mm wafers, as well as specialty substrates used in MEMS, photonics, power electronics, and advanced packaging applications. Custom carrier solutions are available for unique substrate dimensions and handling requirements.
Yes. Fabmatics U.S. wet bench systems are engineered with a highly modular architecture, allowing them to be customized for a wide range of process chemistries and applications. Our engineering team works closely with customers to evaluate chemical compatibility, process requirements, safety considerations, throughput goals, and facility infrastructure before designing a tailored solution.
Supported chemistries can include:
- Acids: HF, HCl, HNO₃, H₂SO₄, H₃PO₄, and blended acid formulations
- Bases: KOH, TMAH, NH₄OH, and other alkaline chemistries
- Oxidizers: H₂O₂ and specialty oxidizing solutions
- Solvents: IPA, Acetone, NMP, DMSO, and other process solvents
- Specialty Chemistries: Customer-specific formulations for MEMS, compound semiconductors, photonics, advanced packaging, and R&D applications
Yes. Fabmatics U.S. wet processing equipment can integrate with factory automation and manufacturing systems through industry-standard communication protocols. Typical integrations include SECS/GEM, MES connectivity, recipe management, equipment monitoring, production data collection, alarm reporting, and traceability functions. Additional customization is available to support specific factory automation and Industry 4.0 requirements.
Fabmatics USA provides solutions ranging from flexible R&D platforms and pilot-line systems to fully automated production equipment. Our modular designs allow customers to develop and optimize new processes in research environments while maintaining a clear path toward scaling into pilot and volume manufacturing. This approach minimizes technology transfer risks and reduces time to production.
Yes. Fabmatics USA provides local sales, project management, application support, installation coordination, and customer service resources within the United States. Customers additionally benefit from the global engineering and manufacturing expertise of the Fabmatics and SCIO Automation organizations, ensuring responsive support throughout the equipment lifecycle.
Let's Discuss Your Wet Process Requirements
Saul Martinez
Sales Manager Fabmatics USA
+ 1 (925) 785-9721
E-Mail
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Fabmatics USA Inc.
326 Broad St., Suite 1
Utica, NY 13501